Multi Top Pie Sawing
Product Description
| SALIENT FEATURES | |
| ► No Requirement of UV Glue. | |
| ► Additional 50% Production with Single Laser Diode. | |
| ► No more Diamond Detachment Problem during cutting Process. | |
| ► Multi Top Sawing in Single Sticking. | |
| ► Lower Investment, Greater Yield | |
| LASER SYSTEM | |
| ► Laser | ► DPSS (ND : YAG) Diode Pumped |
| ► Diode Module | ► DPSS Premium Diode or Northrop Grumman |
| ► Central Emission Wavelength | ► 1064nm |
| ► Transverse Mode | ► TEMoo |
| ► Q-Switched Output Power | ► Upto 24 Watt at 10KHZ |
| ► Pulse to Pulse Stability | ► (% rms)< 1.6 % 6Khz |
| ► Beam Polarization | ► Linear |
| ► Beam Pointing Stability | ► 15 μ Rad |
| ► Pulse Repetition Rate | ► 1 - 20 KHZ |
| ► Laser Class | ► IV |
| CNC SYSTEM | |
| ► Axis Travel | ► X-Axis : 135mm, Y-Axis : 135mm, Z-Axis : 70mm |
| ► Repeatability | ► 5 Micron/25mm Bidirectional |
| ► Accuracy | ► 2 Micron |
| ► Straightness & Flatness of Travel | ► 5 Micron/25mm |
| ► Drive | ► AC Servo |
| COMPUTER SPECIFICATION | |
| ► Intel core i3 processor | |
| ► 4GB RAM, 1TB HHD, 450 WATT SMPS | |
| ► Higher Configuration | |
| ► 17″ LCD Screen | |
| ELECTRICAL | |
| ► Machine Power Consumption | ► 1 Ø, 230 Volts AC, 12 Amps |
| TEMPERATURE | |
| ► Operating Temperature | ► 18 to 30 C˚ |
| CHILLER | |
| ► Cooling Capacity | ► 1200 Watt |
| ► Power Consumption | ► 1 Ø 230Volts, 8 Amps |
| DIMENSION | |
| ► Length x Width x Height | ► 63" x 36" x 60" |
| ► Weight | ► ~700 kg |
